The China International Industry Fair held in Shanghai last week provided us with the perfect opportunity to unveil our new family of VIA Edge AI systems powered by the Qualcomm® Snapdragon 820E Embedded Platform that we are rolling out in Q4 this year. Continue reading VIA Edge AI systems unveiled in Shanghai at China International Industry Fair
I’m looking forward to leaving for Shanghai tomorrow to attend the China International Industry Fair at the National Exhibition and Convention Center before hopping over to Hangzhou for Empower Digital China being held by Alibaba.
Forging close links with software and cloud ecosystem partners is critical to providing complete IoT and Edge AI solutions for our customers across multiple vertical markets. That’s why we are excited to announce that we are working together with FogHorn, a leading developer of software for industrial and commercial Internet of Things (IIoT) solutions to enable their edge intelligence of our VIA ARTiGO and VIA AMOS systems. For more information, please see the press release here.
With so much happening in the technology industry, it can be very easy to lose track of the signal amid all the noise when trying to figure out the key trends that are driving the market. We try to keep our own analysis as simple as possible, building our overall strategy upon these three key drivers:
On Sunday evening I met an old friend at the Grand Hyatt and we spent a fun couple of hours chewing the fat over how the industry has changed since the PC was at the center of the universe and the hotel’s Cheers Bar was the place to see and be seen when Computex was at its height.
A fun day at the China Children’s Computer Contest talking with the students and watching them grapple with the mysteries of AI technology! Some of them had come from as far away as the western province of Xinjiang and taken 40-hour train journeys to attend the event. I decided not to bore them with my own tales of long-distance rail and bus journeys when I was studying in China in the 1980s. I suspect that my experiences are a lot more fun in retrospect than they were at the time.
Taking my first ever ride on a self-driving EV bus was by far the biggest highlight of my trip to China. Doubly so because we provided the brains of the vehicle in the form of a VIA Mobile360 system that our engineers customized to meet the specific needs of our partner, Enchi Auto.
Here’s a photo of the latest VPai Home models that we displayed at the Hong Kong Consumer Electronics Fair last week. In addition to the VPai Home Smart Security IP Camera that we announced at CES in January, they included our new smart doorbell and panoramic IP camera. Ten of our partners demonstrated the devices at their booths, attracting an enthusiastic response from visitors to the show.
An interesting couple of days at the VIA office in Fremont, California, reviewing the new systems based on the VIA Mobile360 SVS and VIA Smart Recognition platforms that we are developing for markets in the US and Latin America.
A busy second day at Embedded World 2018. I haven’t seen any visitor numbers, but show attendance appears to be very good this year, even though the event is taking place at the same time as the much more glitzy and glamorous Mobile World Congress in Barcelona. I take this as a healthy sign of the growing momentum in the industrial and enterprise IoT sectors.