A lively start to Embedded World 2018!
I blame the oracle for its failure to warn me at Paris CDG that my luggage wouldn’t be accompanying me to Nuremberg. Obviously, it had nothing to do with the gross incompetence, I mean effortless efficiency, of the airport. I still can’t quite decide whether it’s the worst airport I’ve ever had the misfortune of visiting – an accolade that I’ve reserved for Manila for many years.
Whenever I first see the specs for a new edge computing system it never ceases to surprise me how much support we provide for legacy I/O standards like RS-232 that have long disappeared from the PC form factor.
If you are planning to visit Embedded World this week, please feel free to stop by the VIA at Booth 4A-251 in Hall 4 of the Nuremberg Exhibition Centre to see our latest Enterprise IoT and Mobile360 innovations. Continue reading VIA at Embedded World 2016