Today we announced the latest addition to our growing family of VIA Mobile360 in-vehicle safety systems. The VIA Mobile360 M810 has been designed for buses, coaches, trucks and other larger vehicles, and supports up to six automotive-grade HD FOV-40° and FOV-190° cameras for the flexible integration of ADAS, SVS, DMS, and DVR features. Check out the table below for the full list of the combinations that the system supports. Continue reading notes from the field: new VIA Mobile360 M810 in-vehicle safety system
We plan to introduce a number of new products at Embedded World 2020 next week, starting with the latest addition to our highly successful family of ruggedized VIA AMOS-3000 Series systems for commercial, industrial, and embedded computing applications.
The VIA AMOS-3006 embedded transportation system continues with this tradition, sporting a tough and durable enclosure able to withstand the most challenging indoor and outdoor operating conditions and temperature ranges. With its two CAN Bus ports and integrated power module supporting a wide voltage range and smart power management for vehicles, the system is also designed for fleet management installations. Continue reading Notes from the field: VIA AMOS-3006 embedded transportation system
We’re putting the final touches to our preparations for Embedded World 2020, which takes place in Nuremberg, Germany, from February 25 – 27. Our booth is located in the same spot as in previous years in Hall 2, #2-551.
The future of vehicle safety is the core theme of our booth. We will be showcasing our VIA Mobile360 family of specialized in-vehicle solutions for commercial applications ranging from public transportation, taxis, and ridesharing services to mining, construction, and industrial environments. Continue reading Notes from the field: VIA at Embedded World 2020
A lively start to Embedded World 2018!
I blame the oracle for its failure to warn me at Paris CDG that my luggage wouldn’t be accompanying me to Nuremberg. Obviously, it had nothing to do with the gross incompetence, I mean effortless efficiency, of the airport. I still can’t quite decide whether it’s the worst airport I’ve ever had the misfortune of visiting – an accolade that I’ve reserved for Manila for many years.
Whenever I first see the specs for a new edge computing system it never ceases to surprise me how much support we provide for legacy I/O standards like RS-232 that have long disappeared from the PC form factor.
If you are planning to visit Embedded World this week, please feel free to stop by the VIA at Booth 4A-251 in Hall 4 of the Nuremberg Exhibition Centre to see our latest Enterprise IoT and Mobile360 innovations. Continue reading VIA at Embedded World 2016