Category Archives: VIA

Embedded World 2019: measuring tradeshow ROI

measuring tradeshow ROI

Just before I left for Embedded World, one of our interns asked me how we measure tradeshow ROI. An excellent question, and one that isn’t necessarily as simple to answer as you might think.

The most obvious and tangible way of measuring ROI is by tracking the number of new sales prospects or leads that you generate at an event. With the right CRM system in place, it’s possible to dig even deeper by tracking the revenue generated by the prospects and the types of products they buy so that you can build up a more complete picture of the long-term ROI. However, it is important not to get too carried away with these numbers because of a lot of other factors are generally involved before a sale is completed. Attracting the prospect is just the first step.

Continue reading Embedded World 2019: measuring tradeshow ROI

Embedded World 2019: enabling visual intelligence

Embedded World 2019

A lively start to Embedded World! We saw a lot of interest in our latest visual intelligence systems, including the VIA Mobile360 D700 Drive Recorder that we demonstrated for the first time at the show.

The device enhances fleet management and driver safety and efficiency by recording each trip using its dual 1080p front dash and interior cameras and enabling real-time route tracking and monitoring via a cloud portal through its 4G wireless, Wi-Fi, and GPS support. Continue reading Embedded World 2019: enabling visual intelligence

Embedded World 2019: making final preparations

final preparations

No signs of 5G at Embedded World. Not a single poster heralding the impending arrival of the next big connectivity revolution. Not even a single dodgy benchmark showing amazing performance speeds.

This comes as no big surprise given that the technology will be rolled out in consumer smart phones first. But I’m sure it will make an appearance at next year’s event as the main applications for 5G will be found in large-scale industrial and smart city deployments in which the embedded industry’s experience and expertise in implementing complex, large-scale projects requiring the integration of diverse communications and computing technologies will come into play. Continue reading Embedded World 2019: making final preparations

Embedded World 2019: a beautiful sunny afternoon in Nuremberg

Nuremberg

A beautiful sunny afternoon in Nuremberg. I’d forgotten that the shops close on Sundays in Germany. A healthy antidote to the 24/7 always-on lifestyle that we are supposed to follow these days.

I’d forgotten too how soft the mattresses and pillows are in the hotels in Germany (or at least the ones I usually stay in). I hope that my back is up to dealing with them, not to mention the long hours standing at the VIA booth at Embedded World. At least the show lasts only three days. I still have nightmares about spending seven and on at least one occasion eight days working on our stand at CeBIT. So much for the good old days! Continue reading Embedded World 2019: a beautiful sunny afternoon in Nuremberg

VIA at Embedded World 2019: new VPai smart lock

One of the most exciting new products we will be launching at at Embedded World 2019 is the VPai Smart Lock Turnkey Platform aimed at the rapidly-growing smart security device market. Germany. This versatile system features a connected wide-angle camera and offers multiple levels of access authentication in a single, securely-designed device that can be connected to Cloud management services. It can be used in either residential or commercial buildings, and provides multiple customization options to meet specific installation requirements.

VPai Smart Lock features a durable aluminum enclosure that houses a high-quality wide-angle HD camera with night vision capabilities and PIR motion detection, two-way audio for remote calling, a fingerprint recognition module, an NFC card reader, a 12-key touch pad, a 2.7” TFT display, and a tamper switch that triggers an automated alarm when it detects an attemp to dismantle it.  Other features include Wi-Fi connectivity, two Li-Ion batteries, and the lock motor. Continue reading VIA at Embedded World 2019: new VPai smart lock

Taking buildings into the 21st century

Taking buildings into the 21st century

Taking buildings into the 21st century is  easier than ever before as a result of a new generation of IoT and Edge AI systems that bring sensors, cameras and control mechanisms together in a truly intelligent management ecosystem. This technology is not exclusive to the latest hyper-modern new builds; it’s just as applicable to any commercial, industrial or residential building because of the many advantages it affords, including reduced energy consumption, predictive maintenance alerts, increased security, greater occupant comfort and safety, and the more efficient utilization of building assets and services. All these drive costs done and less systems downtime (fewer complaints from building residents), thus an excellent ROI.

Continue reading Taking buildings into the 21st century

VIA at Embedded World 2019: enabling smart buildings with the VIA ARTiGO A820

enabling smart buildings

Smart buildings that are aware of and react to their environment can bring considerable benefits to both owners and users, including lower energy consumption, predictive maintenance alerts for HVAC equipment, greater security, improved occupant comfort and safety, and increased utilization of assets and services. This not only improves the immediate environment as the building actively and intelligently reacts to the ebb and flow of everyday life, but also acts to reduce energy consumption and positively contribute to the fight against climate change.

VIA offers a growing family of smart building solutions that enable hybrid processing between edge device and cloud and provide the flexibility required for addressing key issues, such as centralized management and data collection balanced against available bandwidth, time-to-action latency, connection reliability, security, and cost.

Continue reading VIA at Embedded World 2019: enabling smart buildings with the VIA ARTiGO A820

VIA Smart Retail Engagement System at Embedded World 2019

smart retail engagement

If you’re considering adding personalized services to your stores that leverage the latest Edge AI technologies to increase customer loyalty and enhance staff efficiency, take a look at the VIA Smart Retail Engagement System at the VIA booth at Embedded World 2019. Continue reading VIA Smart Retail Engagement System at Embedded World 2019

VIA Mobile360 ADAS system at Embedded World 2019

VIA Mobile360 in-vehicle system Embedded World 2019

Embedded World 2019 is less than a month away, and we have been busy making our final preparations the show.

One of the highlights of our booth will be our Edge AI solutions for smart transportation, including the VIA Mobile360 ADAS system. Combining a ruggedized design with wide voltage input, wide operating temperature range, and sophisticated power management, the system has been designed for the most demanding on-road and off-road conditions and use cases. Continue reading VIA Mobile360 ADAS system at Embedded World 2019