Writing my preview of Embedded World yesterday reminded me that we have quite an intensive VIA events calendar for 2020. Not to mention a heavy travel schedule for yours truly as straight after the show in Nuremberg I head to Indianapolis for the Work Truck Show 2020 and then go on to Las Vegas for CONOXPO-CON/AGG 2020.
I’m particularly looking forward to going to the Work Truck Show 2020 because this will be my first ever visit to Indianapolis and the first time I’ve ever attended a commercial transportation exhibition as opposed to a technology tradeshow. I’m sure it’s going to be a hugely enjoyable and educational experience.
This is the first time (I’m sensing a theme developing here), also, that VIA has attended the Work Truck Show. Our booth is located at Level 1 #5507. For more information about our plans, please click here.
Although I’ve been to Las Vegas more times than I can remember, it has only been to attend Comdex (remember that?) and CES. As the largest construction trade show in North America, CONEXPO-CON/AGG 2020 promises to be very different. As with the Work Truck Show, I’m sure that I’m going to have a lot of fun learning about how this industry works and its safety requirements.
We plan to show our VIA Mobile360 Mining Kit and other specialist systems at the VIA booth, which is located in the Bronze Hall at #B90275. For more information, please click here.
Q2 promises to be just as busy as Q1. In April we will be returning to Indianapolis for NAFA 2020 and then to Tokyo for ESEC 2020. CIM 2020 in Montreal in early May rounds off the list, at least for now. We still have to figure out what we’ll do for Computex in in the first week of June.