notes from the field: VIA at Embedded World 2020

embedded world 2020

No big surprise that there was a subdued atmosphere at the opening of Embedded World 2020 given the number of cancellations by key vendors. Fortunately, the mood lightened during the day as more and more visitors arrived.

While the show wasn’t as busy as in previous years, we had a steady stream of customers come to the VIA booth. For all the benefits of online communication, it still doesn’t fully replace old-fashioned face-face interactions. There’s no better way of understanding customer needs and building long-term relationships.

embedded world 2020

The focus of our booth was of course our VIA Mobile360 family of in-vehicle safety systems and devices. Our colorful bus demo garnered the lion’s share of attention along with the VIA Mobile360 D700 AI Dash Cam. There was a lot interest too in our embedded systems, boards, and modules, most notably the VIA AMOS-3006 which we announced last week.

embedded world 2020

In the afternoon I gave a presentation on the vehicle safety market at the kind invitation of TAITRA, the Taiwan External Trade Council. One of the key points I made is that this market offers tremendous opportunities not just for VIA but the embedded industry as a whole. With its high levels of fragmentation and complex Computer Vision and AI technology development and deployment requirements, the vehicle safety market has a huge need for the deep innovation, integration, and customization capabilities that companies from the industry have decades of expertise and experience in providing.

embedded world 2020

I also outlined our own plans for accelerating the development of a new range of VIA Mobile360 AI Safety Kits for specialist verticals such as mining, including the integration of ultrasonic and mmWave radar capabilities.

We’ll be demonstrating systems with these capabilities at our booth at CONEXPO-CON/AGG in Las Vegas from March 10-14. To learn more, please click here.

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